Metal core PCB, also known as MCPCBs, are designed to dissipate heat from components. They are usually used in electronics and high-temperature devices.
Unlike normal PCBs, these boards have good conductivity and robust thermal dissipation properties.
This makes them ideal for use in led pcb board. However, you need to be careful about the dielectric material and the thickness of the board as they can impact performance.
Base material
The base material used in metal core pcb multi layer pcb pcb package led pcb board is an aluminum substrate. This is a very durable and thermally conductive material that provides good heat dissipation.
In the LED industry, designers have found that it’s not possible to make sure that LEDs are stable and reliable if they don’t dissipate their heat. This has caused issues in applications such as high-power LED lighting.
To solve this problem, designers have developed metal core PCBs that utilize a special base material to divert heat from the board and redirect it to a metal backing plate. This helps to keep critical components cool and saves money.
Thermal insulation layer
The insulating layer of metal core pcb multi layer pcb pcb package led pcb board is an electrolytic copper foil, usually ranging in thickness from one to ten ounces. It is placed between a thermal conductive laminate and the base material of the board.
The insulation layer helps prevent a PCB from conducting heat when exposed to intense electrical currents. This is important to a wide variety of electronic applications, from power supply boards to LED PCBs.
In LED technology, overheating is a serious concern because of the high-power output and the large number of LEDs that are typically mounted on circuit boards. Aluminum is an excellent choice for this application because it has great thermal conductivity, and it will help dissipate heat quickly to reduce the possibility of overheating.
In addition to their ability to dissipate heat, metal core PCBs are more dimensionally stable than circuits made with FR4. This means that they will not change in size over time as the temperature changes, making them the perfect choice for a variety of electronics applications.
Electroless plating
Electroless plating is one of the most popular surface finish deposition methods used in electronic packaging. This type of plating provides a variety of benefits for PCBs, including corrosion resistance and durability.
In addition, it provides high-speed deposit rates and bright and semi-bright finishes. It is also available with varying levels of phosphorus, from 5% to 9%.
Aside from copper, it can be used to coat other components, such as connectors and solder paste holders. It is also commonly used to make a metallic overlay of gold.
The electroless copper process can deposit a continuous metal deposit that is uniform in thickness and color. It is based on heterogeneous oxidation of reducing agents on a catalytically active region of the metal surface.
For multilayer dielectric stackups, it is important to pre-drill slightly larger holes into the base layer before drilling plated through holes. This will help avoid short-circuits when conductive component leads are inserted into the bottom layer.
Layout
Metal core pcb package are multi layer PCBs that use a thermal dielectric prepreg instead of FR4. They also feature a metal plate laminated to the bottom for thermal transfer.
MCPCBs are very effective at dissipating heat and can be used for power supplies and LED applications. They are particularly useful in digital camera flash and HDI lamination applications that require very high temperature dispersion in a small footprint.
This type of PCB is double sided and has two layers of copper conductor. The metal core is in between the conductors on both allmeaninginhindi sides.
Unlike standard single-layer boards, double-sided MCPCBs must follow a different fabrication process. They must be pre-drilled and insulated for any plated through holes, which can be a challenge. Similarly, vias on the bottom side must be filled with insulating filler material before the vias are placed between signal layers to prevent the vias from shorting out.
